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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

B57820M0561A005 데이터 시트보기 (PDF) - TDK Corporation

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B57820M0561A005
TDK
TDK Corporation TDK
B57820M0561A005 Datasheet PDF : 18 Pages
First Prev 11 12 13 14 15 16 17 18
Temperature measurement and compensation
Leadless NTCs
B57820M
M820
8
Placement and orientation of SMD NTC thermistors on PCB
a) Component placement
It is recommended that the PC board
should be held by means of some
adequate supporting pins such as
shown left to prevent the SMDs from
being damaged or cracked.
b) Cracks
c) Component orientation
When placing a component near an
area which is apt to bend or a grid
groove on the PC board, it is advisable
to have both electrodes subjected to
uniform stress, or to position the
component's electrodes at right angles
to the grid groove or bending line (see
c) Component orientation).
Choose a mounting position that
minimizes the stress imposed on the
chip during flexing or bending of the
board.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 18

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