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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

ISL43681 데이터 시트보기 (PDF) - Renesas Electronics

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ISL43681 Datasheet PDF : 18 Pages
First Prev 11 12 13 14 15 16 17 18
ISL43681, ISL43741
ISL43681, ISL43741
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
L20.4x4
20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220VGGD-1 ISSUE I)
SYMBOL
A
A1
A2
A3
b
D
D1
D2
E
E1
E2
e
k
L
N
Nd
Ne
P
MILLIMETERS
MIN
NOMINAL
MAX
NOTES
0.80
0.90
1.00
-
-
0.02
0.05
-
-
0.65
1.00
9
0.20 REF
9
0.18
0.25
0.30
5, 8
4.00 BSC
-
3.75 BSC
9
1.95
2.10
2.25
7, 8
4.00 BSC
-
3.75 BSC
9
1.95
2.10
2.25
7, 8
0.50 BSC
-
0.20
-
-
-
0.35
0.60
0.75
8
20
2
5
3
5
3
-
-
0.60
9
-
-
12
9
Rev. 2 11/04
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land Pattern
Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P & are present when
Anvil singulation method is used and not present for saw
singulation.
FN6053 Rev 3.00
Mar 13, 2006
Page 18 of 18

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