NCV8184 데이터 시트보기 (PDF) - ON Semiconductor
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NCV8184 Datasheet PDF : 20 Pages
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NCV8184
160
150
140
130
1.0 oz Cu
120
110
2.0 oz Cu
100
90
80
0
100
200
300
400
500
600
700
COPPER HEAT SPREADER AREA (mm2)
Figure 25. SOIC−8, qJA as a Function of the Pad Copper Area, Board Material FR4
1000
100 50% Duty Cycle
20%
10%
10 5%
2%
Notes:
1 1%
Single Pulse
(1.0 in pad PCB) Die Size = 2.08 x 1.55 x 0.40 5.0% Active Area
0.1
0.000001 0.00001 0.0001 0.001
0.01
0.1
1
PULSE TIME (sec)
PDM
t1
t2
t1
Duty Cycle, D = t 2
10
100
1000
Figure 26. SOIC−8 Thermal Duty Cycle Curves on 1.0 in Spreader Test Board, 1.0 oz Cu
1000
100
10
Cu Area 100 mm2
Cu Area 645 mm2
1
0.1
0.000001 0.00001 0.0001
0.001
0.01
0.1
1
10
PULSE TIME (sec)
Figure 27. SOIC−8 Single Pulse Heating Curve
100
1000
http://onsemi.com
10
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