RFD16N02L9A 데이터 시트보기 (PDF) - Harris Semiconductor

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RFD16N02L9A

16A, 20V, 0.022Ω, N-Channel Logic Level Power MOSFET

Harris Semiconductor 

RFD16N02L, RFD16N02LSM

TO-252AA

SURFACE MOUNT JEDEC TO-252AA PLASTIC PACKAGE

E

H1

b2

D

1

b

3

e

e1

TERM. 4

L2

b1

A

A1

SEATING

PLANE

L

L1

c

J1

0.265

(6.7)

L3

b3

0.265 (6.7)

BACK VIEW

0.070 (1.8)

0.118 (3.0)

0.063 (1.6)

0.063 (1.6)

0.090 (2.3)

0.090 (2.3)

MINIMUM PAD SIZE RECOMMENDED FOR

SURFACE-MOUNTED APPLICATIONS

INCHES

MILLIMETERS

SYMBOL MIN

MAX

MIN

MAX NOTES

A

0.086

0.094

2.19

2.38

-

A1

0.018

0.022

0.46

0.55

4, 5

b

0.028

0.032

0.72

0.81

4, 5

b1

0.033

0.040

0.84

1.01

4

b2

0.205

0.215

5.21

5.46

4, 5

b3

0.190

-

4.83

-

2

c

0.018

0.022

0.46

0.55

4, 5

D

0.270

0.290

6.86

7.36

-

E

0.250

0.265

6.35

6.73

-

e

0.090 TYP

2.28 TYP

7

e1

0.180 BSC

4.57 BSC

7

H1

0.035

0.045

0.89

1.14

-

J1

0.040

0.045

1.02

1.14

-

L

0.100

0.115

2.54

2.92

-

L1

0.020

-

0.51

-

4, 6

L2

0.025

0.040

0.64

1.01

3

L3

0.170

-

4.32

-

2

NOTES:

1. These dimensions are within allowable dimensions of Rev. B of

JEDEC TO-252AA outline dated 9-88.

2. L3 and b3 dimensions establish a minimum mounting surface for

terminal 4.

3. Solder finish uncontrolled in this area.

4. Dimension (without solder).

5. Add typically 0.002 inches (0.05mm) for solder plating.

6. L1 is the terminal length for soldering.

7. Position of lead to be measured 0.090 inches (2.28mm) from bottom

of dimension D.

8. Controlling dimension: Inch.

9. Revision 6 dated 10-96.

9

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