MBRF1060CT 데이터 시트보기 (PDF) - Sangdest Microelectronic (Nanjing) Co., Ltd
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MBRF1060CT Datasheet PDF : 5 Pages
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SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N0822, Rev. A
Electrical Characteristics:
Characteristics
Max. Forward Voltage Drop
(per leg)*
Max. Reverse Current at DC
condition (per leg)
Max. Reverse Current (per
leg)*
Max. Junction Capacitance
(per leg)
Typical Series Inductance
(per leg)
Max. Voltage Rate of Change
RSM Isolation Voltage
(t = 1.0 second, R. H. < =30%,
TA = 25 °C)
* Pulse Width < 300µs, Duty Cycle <2%
Symbol
VF1
VF2
IR1
IR2
CT
LS
dv/dt
VISO
Condition
@ 5A, Pulse, TJ = 25 °C
@ 5 A, Pulse, TJ = 125 °C
@VR = rated VR
TJ = 25 °C
@VR = rated VR
TJ = 125 °C
@VR = 5V, TC = 25 °C
fSIG = 1MHz
Measured lead to lead 5 mm from
package body
-
Clip mounting, the epoxy body
away from the heatsink edge by
more than 0.110" along the lead
direction.
Clip mounting, the epoxy body is
inside the heatsink.
Screw mounting, the epoxy body
is inside the heatsink.
MBRF1060CT
Green Products
Max.
0.70
0.65
1.0
15
220
8.0
10,000
4500
Units
V
V
mA
mA
pF
nH
V/µs
V
3500
1500
Thermal-Mechanical Specifications:
Characteristics
Junction Temperature Range
Storage Temperature Range
Maximum Thermal
Resistance Junction to Case
(per leg)
Approximate Weight
Case Style
Symbol
TJ
Tstg
RθJC
Condition
-
-
DC operation
wt
-
ITO-220AB
Specification
-55 to +150
-55 to +150
3.5
Units
°C
°C
°C/W
2
g
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