AD8132ARZ-REEL7 데이터 시트보기 (PDF) - Analog Devices

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AD8132ARZ-REEL7

Low Cost, High Speed Differential Amplifier

Analog Devices 

ABSOLUTE MAXIMUM RATINGS

Table 7.

Parameter

Rating

Supply Voltage

±5.5 V

VOCM

Internal Power Dissipation

±VS

250 mW

Operating Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, θJA is

specified for the device soldered in a circuit board in still air.

Table 8.

Package Type

8-Lead SOIC, 4-Layer

8-Lead MSOP, 4-Layer

θJA

Unit

121

°C/W

142

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation in the AD8132 packages

is limited by the associated rise in junction temperature (TJ) on

the die. At approximately 150°C, the glass transition temperature,

the plastic changes its properties. Even temporarily exceeding

this temperature limit can change the stresses that the package

exerts on the die, permanently shifting the parametric performance

of the AD8132. Exceeding a junction temperature of 150°C for

an extended period can result in changes in the silicon devices,

potentially causing failure.

AD8132

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

power is the voltage between the supply pins (VS) times the

quiescent current (IS). The load current consists of the differential

and common-mode currents flowing to the load, as well as

currents flowing through the external feedback networks and

the internal common-mode feedback loop. The internal resistor

tap used in the common-mode feedback loop places a 1 kΩ

differential load on the output. Consider rms voltages and

currents when dealing with ac signals.

Airflow reduces θJA. In addition, more metal directly in contact

with the package leads from metal traces through holes, ground,

and power planes reduces the θJA.

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 8-lead SOIC

(θJA = 121°C/W) and 8-lead MSOP (θJA = 142°C/W) packages

on a JEDEC standard 4-layer board. θJA values are approximations.

1.75

1.50

1.25

1.00

SOIC

0.75

MSOP

0.50

0.25

0

–40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 100 110 120

AMBIENT TEMPERATURE (°C)

Figure 3. Maximum Power Dissipation vs. Ambient Temperature

ESD CAUTION

Rev. I | Page 9 of 32

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