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HMC361

GaAs HBT MMIC DIVIDE-BY-2, DC - 11 GHz

Hittite Microwave 

v07.0109

HMC361

GaAs HBT MMIC

DIVIDE-BY-2, DC - 11 GHz

1

Output Voltage Waveform,

Pin= 0 dBm, Fout= 882 MHz, T= 25 °C

500

300

100

-100

-300

-500

22.7

23.1

23.5

23.9

24.3

24.7

TIME (nS)

Absolute Maximum Ratings

RF Input (Vcc = +5V)

Vcc

VLogic

Junction Temperature (Tj)

Continuous Pdiss (T= 85 °C)

(derate 15.9 mW/ °C above 85 °C)

Thermal Resistance (RTH)

(junction to die bottom)

Storage Temperature

Operating Temperature

+13 dBm

+5.5V

Vcc -1.6V to Vcc -1.2V

135 °C

0.79W

63 °C/W

-65 to +150 °C

-55 to +85 °C

Typical Supply Current vs Vcc

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Vcc (V)

Icc (mA)

4.75

74

5.0

83

5.25

89

Note: Divider will operate over full voltage range shown above

Outline Drawing

1-4

Die Packaging Information [1]

Standard

Alternate

WP-8 (Waffle Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

NOTES;

1. ALL DIMENSIONS IN INCHES (MILLIMETERS)

2. ALL TOLERANCES ARE ± 0.001 (0.025)

3. DIE THICKNESS IS 0.004 (0.100) BACKSIDE IS GROUND

4. BOND PADS ARE 0.004 (0.100) SQUARE

5. BOND PAD SPACING, CTR-CTR: 0.006 (0.150)

6. BACKSIDE METALLIZATION: GOLD

7. BOND PAD METALLIZATION: GOLD

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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