CXP5084 데이터 시트보기 (PDF) - Sony Semiconductor
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CXP5084 Datasheet PDF : 11 Pages
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Package Outline
Unit: mm
64
64PIN SDIP (PLASTIC)
+ 0.4
57.6 – 0.1
33
1
32
1.778
0° to 15°
0.5 ± 0.1
0.9 ± 0.15
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-64P-01
SDIP064-P-0750
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
PACKAGE MASS
42 ALLOY
8.6g
64PIN QFP(PLASTIC)
51
52
23.9 ± 0.4
+ 0.4
20.0 – 0.1
33
32
+ 0.1
0.15 – 0.05
0.15
CXP5084/5086
64
1
1.0
19
+ 0.15
0.4 – 0.1
20
+ 0.2
0.1 – 0.05
+ 0.35
2.75 – 0.15
0.2 M
0° to10°
SONY CODE
EIAJ CODE
JEDEC CODE
QFP-64P-L01
QFP064-P-1420
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER/PALLADIUM
PLATING
42/COPPER ALLOY
PACKAGE MASS
1.5g
– 11 –
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