HMC141 데이터 시트보기 (PDF) - Micross Components

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HMC141

GaAs MMIC Double-bAlAnCeD MIxer, 6 - 18 GHz

Micross Components 

v04.1111

Outline Drawings

(See HMC141/142 Operation Application Note)

HMC141

HMC141 / HMC142

GaAs MMIC Double-Balanced

Mixer, 6 - 18 GHz

Absolute Maximum Ratings

RF / IF Input

LO Drive

Channel Temperature (Tc)

Thermal Resistance

IF DC Current

Storage Temperature

Operating Temperature

+20 dBm

+27 dBm

150 °C

101.7 °C/W

±2 mA

-65 to +150 °C

-55 to +85 °C

3

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM].

2. DIE THICKNESS IS .004”.

3. TYPICAL BOND PAD IS .004” SQUARE.

4. BACKSIDE METALLIZATION: GOLD.

5. BOND PAD METALLIZATION: GOLD.

6. BACKSIDE METAL IS GROUND.

7. CONNECTION NOT REQUIRED FOR

UNLABELED BOND PADS.

HMC142

Die Packaging Information [1]

Standard

Alternate

WP-3 (Waffle Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

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