MCR8DCM 데이터 시트보기 (PDF) - Kersemi Electronic Co., Ltd.
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MCR8DCM Datasheet PDF : 5 Pages
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MCR8DCM, MCR8DCN
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance — Junction−to−Case
Thermal Resistance — Junction−to−Ambient
Thermal Resistance — Junction−to−Ambient (Note 2)
Maximum Lead Temperature for Soldering Purposes (Note 3)
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristics
OFF CHARACTERISTICS
Peak Repetitive Forward or Peak Repetitive Reverse Blocking Current
(VAK = Rated VDRM or VRRM, Gate Open)
TJ = 25°C
TJ = 125°C
ON CHARACTERISTICS
Peak On−State Voltage (Note 4)
(ITM = 16 A)
Gate Trigger Current (Continuous dc)
(VAK = 12 V, RL = 100 W, TJ = 25°C)
(TJ = −40°C)
Gate Trigger Voltage (Continuous dc)
(VAK = 12 V, RL = 100 W, TJ = 25°C)
(TJ = −40°C)
(TJ = 125°C)
Holding Current
(VAK = 12 V, Initiating Current = 200 mA, Gate Open)
Latching Current
(VAK = 12 V, IG = 15 mA, TJ = 25°C)
(VAK = 12 V, IG = 30 mA, TJ = −40°C)
DYNAMIC CHARACTERISTICS
TJ = 25°C
TJ = −40°C
Critical Rate of Rise of Off−State Voltage
(VAK = Rated VDRM, Exponential Waveform, Gate Open, TJ = 125°C)
2. Surface mounted on minimum recommended pad size.
3. 1/8″ from case for 10 seconds.
4. Pulse Test: Pulse Width ≤ 2.0 ms, Duty Cycle ≤ 2%.
Symbol
RqJC
RqJA
RqJA
TL
Max
Unit
2.2
°C/W
88
80
260
°C
Symbol
Min
Typ
Max
Unit
IDRM,
IRRM
mA
−
−
0.01
−
−
5.0
VTM
V
−
1.4
1.8
IGT
mA
2.0
7.0
15
−
−
30
VGT
V
0.5
0.65
1.0
−
−
2.0
0.2
−
−
IH
mA
4.0
22
30
−
−
60
IL
mA
4.0
22
30
−
−
60
dv/dt
V/ms
50
200
−
ORDERING INFORMATION
Device
Package
Shipping†
MCR8DCMT4
DPAK
16 mm Tape & Reel (2.5 k / Reel)
MCR8DCMT4G
DPAK
(Pb−Free)
16 mm Tape & Reel (2.5 k / Reel)
MCR8DCNT4
DPAK
16 mm Tape & Reel (2.5 k / Reel)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.kersemi.com
2
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