STD12NF06T4 데이터 시트보기 (PDF) - STMicroelectronics
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STD12NF06T4 Datasheet PDF : 10 Pages
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STD12NF06
THERMAL DATA
Rthj-case Thermal Resistance Junction-case
Max
5
Rthj-amb Thermal Resistance Junction-ambient
Max
100
Tl
Maximum Lead Temperature For Soldering Purpose
Typ
275
ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified)
OFF
Symbol
Parameter
Test Conditions
Min. Typ.
V(BR)DSS Drain-source
ID = 250 µA, VGS = 0
60
Breakdown Voltage
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating TC = 100°C
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 20 V
°C/W
°C/W
°C
Max.
Unit
V
1
µA
10
µA
±100
nA
ON (*)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS
ID = 250 µA
VGS = 10 V
ID = 6 A
Min.
2
Typ.
3
0.08
Max.
4
0.1
Unit
V
Ω
DYNAMIC
Symbol
gfs (*)
Ciss
Coss
Crss
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS = 15 V
ID = 6 A
VDS = 25V, f = 1 MHz, VGS = 0
Min.
Typ.
5
315
70
30
Max.
Unit
S
pF
pF
pF
2/10
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