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US1A 데이터 시트보기 (PDF) - Galaxy Semi-Conductor

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US1A
BILIN
Galaxy Semi-Conductor BILIN
US1A Datasheet PDF : 3 Pages
1 2 3
Production specification
Surface Mount Rectifiers
US1A--US1M
FEATURES
z For surface mount applications
Pb
z Low profile package
z Easy pick and place
Lead-free
z Ultrafast recovery times for high efficiency
z Low forward voltagelow power loss
z Built-in strain reliefideal for automated placement
z High temperature soldering:260℃/10 seconds on terminals
z Plastic package has underwriters laboratories flammability classification 94V-0
MECHANICAL DATA
z Case: JEDEC DO-214AC,molded plastic body over passivated chip
z Terminals: Solder Plated, solderable per MIL-STD-750,Method 2026
z Weight: 0.002 ounces, 0.064 gram
Maximum Ratings (@TA = 25°C unless otherwise specified)
Characteristic
Symbol US1A US1B US1D US1G US1J
Maximum recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at TL=110
Peak forward surge current
8.3ms single half sine-wave
superimposed on rated load(JEDEC Method)
Thermal Characteristics
VRRM
50
100
200
400
600
VRWS
35
70
140
280
420
VDC
50
100
200
400
600
IF(AV)
1.0
IFSM
30
Characteristic
Symbol US1A US1B US1D US1G US1J
Typical junction capacitance at 4.0V,1MHZ
CJ
20
RθJA
55
Maximum thermal resistance (NOTE1)
RΘJL
20
Operating temperature range
TJ
-55------- +150
Storage temperature range
TSTG
-55------- +150
Electrical Characteristics (@TA = 25°C unless otherwise specified)
Characteristic
Symbol US1A US1B US1D
Maximum instantaneous forward voltage
VF
1.0
at 1.0A
Maximum DC reverse current @TA=25
IR
at rated DC blocking voltage @TA=125
Maximum reverse recovery time
at IF=0.5A IR=1.0A Irr=0.25A
trr
50
NOTE: 1.P.C.B.mounted on 0.2X0.2"(5.0X5.0mm) copper pad area
US1G
1.25
5.0
100.0
US1J
US1K
800
560
800
US1M
1000
700
1000
US1K
15
US1M
US1K US1M
1.7
75
UNITS
V
V
V
A
A
UNITS
pF
/W
UNITS
V
μA
ns
Document Number : SMA301AA
www.gmicroelec.com
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