A1171EEWLT-P 데이터 시트보기 (PDF) - Allegro MicroSystems
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A1171EEWLT-P Datasheet PDF : 10 Pages
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A1171
Micropower Ultrasensitive Hall Effect Switch
Description (continued)
providing superior reliability and ease of manufacturing while
eliminating the requirement for signal conditioning.
Improved stability is made possible through dynamic offset
cancellation using chopper stabilization, which reduces the residual
offset voltage normally caused by device overmolding, temperature
dependencies, and thermal stress. This device includes, on a single
silicon chip, a Hall-voltage generator, a small-signal amplifier,
chopper stabilization, a latch, and a MOSFET output.
TheA1171 device offers a magnetically optimized solution, suitable
for most applications. Package type EW (0.40 mm maximum height)
offers a leadless surface mount solution. It is lead (Pb) free, with
NiPdAu leadframe plating.
Selection Guide
Part Number
Package
Packing1
A1171EEWLT-P2 DFN/MLP 1.5×2 mm; 0.40 mm maximum height
3000 pieces per 7 inch reel
1Contact Allegro™ for additional packing options.
2Allegro products sold in DFN package types are not intended for automotive applications.
Absolute Maximum Ratings
Characteristic
Supply Voltage
Reverse Supply Voltage
Magnetic Flux Density
Output Off Voltage
Reverse Output Voltage
Output Current
Operating Ambient Temperature
Maximum Junction Temperature
Storage Temperature
Symbol
VDD
VRDD
B
VOUTPx
VROUTPx
IOUTPx(Source)
IOUTPx(Sink)
TA
TJ(max)
Tstg
Range E
Notes
Rating
5
–0.3
Unlimited
5
–0.3
1
–1
–40 to 85
165
–65 to 170
Units
V
V
G
V
V
mA
mA
ºC
ºC
ºC
Pin-out Diagram
VOUTPS 1
6 VDD
VOUTPN 2 PAD 5 NC
SELECT 3
4 GND
Terminal List Table
Name
Number
Function
VOUTPS
1
Push-pull output (selectable omnipolar activation or unipolar
south pole activation)
VOUTPN
2
Push-pull output (selectable inverted omnipolar activation or
unipolar north pole activation)
SELECT
3
Sets activation mode for VOUTPx outputs; omnipolar output
when tied to VDD or floating, unipolar output when grounded
GND
4
Ground
NC
5
No connection
VDD
6
Connects power supply to chip
PAD
–
Exposed pad for enhanced thermal dissipation
Allegro MicroSystems, LLC
2
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
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