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MC74HCT374A

Octal 3-State Noninverting D Flip-Flop with LSTTL-Compatible Inputs

ON Semiconductor 

MC74HCT374A

PACKAGE DIMENSIONS

TSSOP−20

DT SUFFIX

CASE 948E−02

ISSUE C

0.15 (0.006) T U S

2X L/2 20

L

PIN 1

IDENT

1

0.15 (0.006) T U S

C

D

0.100 (0.004)

−T− SEATING

PLANE

20X K REF

0.10 (0.004) M T U S V S

11

B

−U−

10

A

−V−

GH

J JÍÍÍ1 ÍÍÍKÍÍÍK1 ÍÍÍ

SECTION N−N

N

0.25 (0.010)

M

N

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION:

MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE

MOLD FLASH, PROTRUSIONS OR GATE

BURRS. MOLD FLASH OR GATE BURRS

SHALL NOT EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION

SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

F

DETAIL E

DETAIL E

−W−

MILLIMETERS

INCHES

DIM MIN MAX MIN MAX

A 6.40 6.60 0.252 0.260

B 4.30 4.50 0.169 0.177

C --- 1.20 --- 0.047

D 0.05 0.15 0.002 0.006

F 0.50 0.75 0.020 0.030

G

0.65 BSC

0.026 BSC

H 0.27 0.37 0.011 0.015

J 0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K 0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L

6.40 BSC

0.252 BSC

M 0_ 8_ 0_ 8_

SOLDERING FOOTPRINT

7.06

1

16X

0.36

16X

1.26

0.65

PITCH

DIMENSIONS: MILLIMETERS

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