HS-3530RH 데이터 시트보기 (PDF) - Intersil
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HS-3530RH Datasheet PDF : 12 Pages
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Metallization Topology
DIE DIMENSIONS:
54 x 67 x 11.5mils
(1370 x 1700 x 290µm)
METALLIZATION:
Type: Al
Thickness: 12.5kÅ ± 2kÅ
GLASSIVATION:
Type: SiO2
Thickness: 8kÅ ± 1kÅ
Metallization Mask Layout
+IN
HS-3530RH
DIE ATTACH:
Temperature: Metal Can - 420oC (Max)
WORST CASE CURRENT DENSITY:
0.544 x 105 A/cm2 at 2.5mA
SUBSTRATE POTENTIAL (POWERED UP): -V
TRANSISTOR COUNT: 49
PROCESS: Complimentary Bipolar
HS-3530RH
OFFSET
-IN
NULL
-V
(& PACKAGE)
OFFSET NULL
OUTPUT
ISET
+V
Spec Number 518079
772
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