TS27M4BMP 데이터 시트보기 (PDF) - STMicroelectronics

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TS27M4BMP

Precision low power CMOS quad operational amplifiers

STMicroelectronics 

TS27M4C, TS27M4I, TS27M4M

4

Package information

Package information

In order to meet environmental requirements, STMicroelectronics offers these devices in

ECOPACK® packages. These packages have a lead-free second level interconnect. The

category of second level interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics

trademark. ECOPACK specifications are available at: www.st.com.

4.1

DIP14 package information

Figure 15. DIP14 package mechanical drawing

Table 4.

Ref.

a1

B

b

b1

D

E

e

e3

F

I

L

Z

DIP14 package mechanical data

Millimeters

Min.

Typ.

Max.

0.51

1.39

1.65

0.5

0.25

20

8.5

2.54

15.24

7.1

5.1

3.3

1.27

2.54

Min.

0.020

0.055

0.050

Inches

Typ.

0.020

0.010

0.335

0.100

0.600

0.130

Max.

0.065

0.787

0.280

0.201

0.100

9/14

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