MC33363BP 데이터 시트보기 (PDF) - ON Semiconductor
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MC33363BP Datasheet PDF : 12 Pages
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MC33363B
–A–
T
16
9
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC PACKAGE
CASE 751N–01
(SOP–16L)
ISSUE O
–B– P
0.010 (0.25) M B M
1
8
J
13X D
0.010 (0.25) M T A S B S
F
C
–T–
S
SEATING
M
K PLANE
9X G
R X 45_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 10.15 10.45 0.400 0.411
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.50 0.90 0.020 0.035
G
1.27 BSC
0.050 BSC
J 0.25 0.32 0.010 0.012
K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
S
2.54 BSC
0.100 BSC
T
3.81 BSC
0.150 BSC
–A–
R
16
1
P
F
P SUFFIX
PLASTIC PACKAGE
CASE 648E–01
(DIP–16)
ISSUE O
9
–B–
8
M
L
C
J
–T–
SEATING
S
PLANE
H
G
K
D 13 PL
0.25 (0.010) M T B S A S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION A AND B DOES NOT INCLUDE MOLD
PROTRUSION.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.25 (0.010).
6. ROUNDED CORNER OPTIONAL.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.740 0.760 18.80 19.30
B 0.245 0.260 6.23 6.60
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.050 0.070 1.27 1.77
G 0.100 BSC
2.54 BSC
H 0.050 BSC
1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.120 0.140 3.05 3.55
L 0.295 0.305 7.50 7.74
M 0 _ 10_ 0 _ 10_
P
0.200 BSC
5.08 BSC
R 0.300 BSC
7.62 BSC
S 0.015 0.035 0.39 0.88
10
MOTOROLA ANALOG IC DEVICE DATA
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