T5551 데이터 시트보기 (PDF) - Temic Semiconductors

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T5551

Micromodule

Temic Semiconductors 

Micromodule

Dimensions in mm

T5551

Specification

Pitch

Module size

Mold dimension

Lead frame

Bond pad size

Surface plating

Module thickness

9.5 mm

5 8 mm

5.1 4.9 mm

CuSn6 100 µm

5 1.5 mm

2.5 µm Ag

400 µm maximum

Rev. A1, 14-Jun-00

Temperature Profile for Processing

150_C / 5 min

390_C / 3 s

500_C / 25 ms

3 (4)

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