NCP1294ED16 데이터 시트보기 (PDF) - ON Semiconductor
부품명
상세내역
일치하는 목록
NCP1294ED16 Datasheet PDF : 13 Pages
| |||
−A−
16
1
NCP1294
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE K
9
−B− P 8 PL
8
0.25 (0.010) M B S
−T− SEATING
PLANE
G
K
C
D 16 PL
0.25 (0.010) M T B S A S
F
R X 45_
M
J
SOLDERING FOOTPRINT
8X
6.40
16X 1.12
1
16
16X
0.58
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G
1.27 BSC
0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
PACKAGE THERMAL DATA
Parameter
RqJC
RqJA
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
Typical
Typical
SOIC−16
28
115
Unit
°C/W
°C/W
http://onsemi.com
12
Share Link: 