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BD6583MUV-A 데이터 시트보기 (PDF) - ROHM Semiconductor

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BD6583MUV-A Datasheet PDF : 27 Pages
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BD6583MUV-A
Technical Note
The coil selection
The DC/DC is designed by more than 4.7µH. When L value sets to a lower value, it is possibility that the specific
sub-harmonic oscillation of current mode DC / DC will be happened.
Please do not let L value to 3.3µH or below.
And, L value increases, the phase margin of DC / DC becomes to zero. Please enlarge the output capacitor value when you
increase L value.
Example)
4.7µH
=
output capacitor 2.2µF/50V
1pcs
6.8µH
=
output capacitor 2.2µF/50V
2pcs
10µH
=
output capacitor 2.2µF/50V
3pcs
This value is just examples, please made sure the final judgment is under an enough evaluation.
Layout
In order to make the most of the performance of this IC, its layout pattern is very important. Characteristics such as efficiency
and ripple and the likes change greatly with layout patterns, which please note carefully.
to Power Supply
CIN
L
CBAT
PWM
Reset
CREG
to Cathode
of LED
to GND
SBD
COUT
VDET
N.C.
Tr
GND
SW
RSENSE
SENSP
TEST
LED6
LED5
LED4
GND
LED3
LED2
to Anode
of each LED
RISET
Fig. 43 Layout
Connect the input bypath capacitor CIN(10µF) nearest to coil L, as shown in the upper diagram.
Wire the power supply line by the low resistance from CIN to VBAT pin. Thereby, the input voltage ripple of the IC can be
reduced. Connect smoothing capacitor CREG of the regulator nearest to between VREG and GND pin, as shown in the upper
diagram. Connect schottky barrier diode SBD of the regulator nearest to between coil L and switching transistor Tr.
And connect output capacitor COUT nearest to between CIN and GND pin. Thereby, the output voltage ripple of the IC can
be reduced.
Connect switching transistor Tr nearest to SW pin. Wire coil L and switching transistor Tr, current sensing resistor RSENSE by the
low resistance. Wiring to the SENSP pin isn't Tr side, but connect it from RSENSE side. Over current value may become low when
wiring from Tr side. Connect RSENSE of GND side isolated to SENS pin. Don’t wire between RSENSE and SNESN pin wiring from
RSENSE pin to GND pin. And RSENSE GND line must be wired directly to GND pin of output capacitor. It has the possibility that
restricts the current drive performance by the influence of the noise when other GND is connected to this GND.
Connect LED current setting resistor RISET nearest to ISET pin. There is possibility to oscillate when capacity is added to ISET
terminal, so pay attention that capacity isn't added. And, RISET of GND side must be wired directly to GND pin.
When those pins are not connected directly near the chip, influence is given to the performance of BD6583MUV-A, and may
limit the current drive performance. As for the wire to the inductor, make its resistance component small so as to reduce electric
power consumption and increase the entire efficiency.
The layout pattern in consideration of these is shown in next page.
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© 2011 ROHM Co., Ltd. All rights reserved.
16/26
2011.06 - Rev.C

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