H11L1-M 데이터 시트보기 (PDF) - Fairchild Semiconductor

부품명

상세내역

일치하는 목록

H11L1-M

6-PIN DIP OPTOISOLATORS LOGIC OUTPUT

Fairchild Semiconductor 

6-PIN DIP

OPTOISOLATORS LOGIC OUTPUT

H11L1M

H11L2M

H11L3M

Package Dimensions (Through Hole)

0.350 (8.89)

0.320 (8.13)

Package Dimensions (Surface Mount)

0.350 (8.89)

0.320 (8.13)

0.260 (6.60)

0.240 (6.10)

0.260 (6.60)

0.240 (6.10)

0.390 (9.90)

0.332 (8.43)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.014 (0.36)

0.010 (0.25)

0.320 (8.13)

0.100 (2.54)

0.015 (0.38)

0.020 (0.50)

0.016 (0.41)

0.100 (2.54)

15°

0.012 (0.30)

Package Dimensions (0.4”Lead Spacing)

0.350 (8.89)

0.320 (8.13)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.025 (0.63)

0.020 (0.51)

0.020 (0.50)

0.016 (0.41)

0.014 (0.36)

0.010 (0.25)

0.320 (8.13)

0.012 (0.30)

0.008 (0.20)

0.100 [2.54]

0.035 (0.88)

0.006 (0.16)

Recommended Pad Layout for

Surface Mount Leadform

0.260 (6.60)

0.240 (6.10)

0.070 (1.77)

0.040 (1.02)

0.014 (0.36)

0.010 (0.25)

0.200 (5.08)

0.115 (2.93)

0.100 (2.54)

0.015 (0.38)

0.020 (0.50)

0.016 (0.41)

0.100 [2.54]

0.012 (0.30)

0.008 (0.21)

0.425 (10.80)

0.400 (10.16)

NOTE

All dimensions are in inches (millimeters)

0.070 (1.78)

0.060 (1.52)

0.425 (10.79)

0.100 (2.54)

0.305 (7.75)

0.030 (0.76)

www.fairchildsemi.com

6 OF 8

11/01/01 DS300222

Share Link: