CXB1563Q 데이터 시트보기 (PDF) - Sony Semiconductor

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CXB1563Q

2R IC for Optical Fiber Communication Receiver

Sony Semiconductor 

Package Outline

Unit: mm

24

25

32PIN QFP (PLASTIC)

9.0 ± 0.2

+ 0.3

7.0 – 0.1

17

16

0.1

+ 0.35

1.5 – 0.15

A

Kokubu Ass'y

32

1

0.8

9

8

b

0.24 M

+ 0.15

b = 0.30 – 0.10

( 0.30)

+ 0.2

0.1 – 0.1

0˚ to 10˚

SONY CODE

EIAJ CODE

JEDEC CODE

QFP-32P-L01

P-QFP32-7x7-0.8

DETAIL A : SOLDER

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

42 / COPPER ALLOY

PACKAGE MASS

0.2g

24

25

32PIN QFP (PLASTIC)

9.0 ± 0.2

+ 0.3

7.0 – 0.1

17

16

0.1

+ 0.35

1.5 – 0.15

A

32

1

0.8

9

8

b

0.24 M

+ 0.15

b = 0.30 – 0.10

( 0.30)

+ 0.2

0.1 – 0.1

0˚ to 10˚

SONY CODE

EIAJ CODE

JEDEC CODE

QFP-32P-L01

P-QFP32-7x7-0.8

DETAIL A : SOLDER

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

42 / COPPER ALLOY

PACKAGE MASS

0.2g

LEAD PLATING SPECIFICATIONS

ITEM

LEAD MATERIAL

SOLDER COMPOSITION

PLATING THICKNESS

SPEC.

42 ALLOY

Sn-Bi Bi:1-4wt%

5-18µm

– 16 –

CXB1563Q

Sony Corporation

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