datasheetbank_Logo
전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

KA278R05 데이터 시트보기 (PDF) - Fairchild Semiconductor

부품명
상세내역
일치하는 목록
KA278R05
Fairchild
Fairchild Semiconductor Fairchild
KA278R05 Datasheet PDF : 18 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Block Diagram
Vin 1
THERMAL SHUTDOWN
BANDGAP REFERENCE
HIGH / LOW
Vdis 4
-
+
OUTPUT
ON / OFF
1.4V
OVERVOLTAGE
PROTECTION
-
+
SOA PROTECTION
Q1
R1
R2
SHORTCIRCUIT
PROTECTION
2 Vo
3
GND
Figure 1. KA278R33 / 05 / 12C
Vin 1
THERMAL SHUTDOWN
BANDGAP REFERENCE
OVERVOLTAGE
PROTECTION
-
+
SOA PROTECTION
SHORTCIRCUIT
PROTECTION
Q1
2 Vo
Rin
4 Vadj
Rref
3
GND
Figure 2. KA278RA05C
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
VIN
Input Voltage
Vdis
Disable Voltage
KA278RXXC
IO
Output Current
PD1
Power Dissipation 1
No Heat-Sink
PD2
Power Dissipation 2
With Heat-Sink
Tj
Junction Temperature
Topr
Operating Temperature
Rθjc
Thermal Resistance, Junction-to Case(1)
Rθja
Thermal Resistance, Junction-to-Air
Note:
1. Junction-to-case thermal resistance test environments:
- Pneumatic heat sink fixture;
- Clamping pressure 60 psi through 12 mm diameter cylinder;
- Thermal grease applied between PKG and heat sink fixture.
Value
35
35
2.0
1.5
15
150
-20 to 80
2.9
48.51
Unit
V
V
A
W
W
°C
°C
°C/W
°C/W
© 2004 Fairchild Semiconductor Corporation
KA278RXXC-Series Rev. 1.1.0
2
www.fairchildsemi.com

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]