17448 데이터 시트보기 (PDF) - Unspecified
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17448 Datasheet PDF : 51 Pages
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After accurate component placement, the board holder is unlocked and transferred to underneath the Micro
Oven™. Here, the BGA or Surface Mount Device is subjected to a 4 zone, full convection reflow profile,
specifically tailored to the requirements of that particular PCB, device and solder paste. Accurate duplica-
tion of original oven reflow parameters is achieved.
During the course of the reflow profile, source temperatures and time intervals can be modified, eliminating
the need to wait for the current profile to terminate before modifications can be made. Precise solder joint
temperatures are measured and displayed on a real time graphical display, providing the necessary data to
accurately and easily establish the optimum reflow profile for each particular applica
tion within minutes.
II. SYSTEM FEATURES AND ACCESSORIES
BGA/CSP-3500 REWORK SYSTEM INCLUDES:
• BGA/CSP-3500 Series Base Unit
• BGA/CSP-3500 Control Unit with BGA-1 Microprocessor digital module
• High Resolution Camera, 1/2” CCD with “C” mount.
• Open-ended adjustable size board holder with under board support.
• 20” High Resolution Color Monitor (Optional)
• BGA-3528 Micro Oven Head Assembly
ACCESSORIES INCLUDED WITH SYSTEM
• MX-500S-11 or MX-500S-21
• SMTC-061 Blade tip cartridge with BGA version, SMTC-0167 with CSP version
• High temperature vacuum pads (19219)
• Spatula Handle (20534)
• Folding Hex Key Set (12236)
• Type “K” thermocouple (30 AWG (21104), 24 AWG (19984))
• One (1) roll of Kapton tape (20207)
• Stencil Adapter (21149)
• Manual for BGA/CSP-3500 Series.
• BGA-S1 Windows™ based software (19759)
• RS-232 PC interface cable (19756)
• SVHS video cable (20092)
• Adjustable BGA (19993) or CSP (20987)Tooling Plate.
• Vacuum Heads
• Height Reference Block 19993
• Gun-sight alignment assembly (20066)
• Hex Wrenches ( 3/32”, 1/16” & .050”)
• FS-24 Footswitch
• Adjustable Board Holder Fingers (AC-CLAMPSET)
BGA-3500 Series Manual 5/01
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