17448 데이터 시트보기 (PDF) - Unspecified

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17448

BGA & CSP Rework System

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THE PROFILE

The concept of the profile:

A profile is the relationship between the temperature and time for a given placement or removal process. The profile is broken into

four components known as the Preheat zone, soak zone, peak zone, and cool zone. Each zone has user definable temperature and time

settings allowing the user to create a profile for almost any removal or placement process.

• Preheat zone is used to pre-heat the circuit board and component in order to drive off moisture that may have been absorbed by

multilayer boards and prevent from the possibility of “popcorning” (local delamination of the part or circuit board). The set

temperature for top and bottom side is identical.

• Soak zone has two temperate settings. One setting is for the preheater that is used to maintain the heat beneath the circuit board.

The second setting is the temperature of the top air that heats all of the solder joints under the micro oven to the sub melting

temperature and ensures joints will melt at Peak zone.

• Peak zone also has two temperature settings that are similar to Soak zone. The appropriate temperature of the top air should be set

in order to ensure solder joints reach their melting point. Note: For the removal mode, the pick-up solenoid will be triggered at the

end of this cycle allowing the component to be automatically removed from the PCB.

• Cool zone is used to cool down the chamber of the micro oven and the solder connections in the place mode, allowing the solder

to solidify at a steady ramp rate and increase solder connection reliability. In the removal mode, the cooling cycle is necessary if

the component is reused and to cool the PCB correctly.

There are two kinds of profiles: One is known as module profile that is stored in the memory device inside the BGA module. The

other known as Library Profile carries more information and is stored on the user-selected drive of their computer. Any profile can

be stored in the preferred location. Periodically, the user should back up profiles by saving onto floppy disk.

The Module Profile

Select temperature scale

Editing Fields of Soak Zone

Editing Fields of Cool Zone

Restore Settings from BGA Module.

Editing Fields of Preheat Zone

Editing Fields of Peak Zone

Select the graphics display

Update settings of BGA Module

The Library Profile

Select the placement

or removal process.

Hardware and process

description area.

ADDENDUM A page 2

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