BGA-3590 데이터 시트보기 (PDF) - Unspecified

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BGA-3590

BGA & CSP Rework System

Unspecified 

16. Turn the vacuum switch (16) to the “on” position.

17. While unlocked, push the spring-loaded head on the Micro Oven down so that the vacuum cup makes a

complete seal on the BGA component which you are removing and then lock the head into place by

tightening the “Z” axis locking knob. You will see the vacuum indicator LED illuminate indicating cor-

rect position and seal to the top of the component.

NOTE: When locking the vacuum tube assembly, excessive downward pressure may damage the vacuum

tube and not allow the component to lift. Please use light pressure!

18. With the vacuum switch still in the “on” position, press the start button or click on the start icon to

begin the removal cycle. The system will cycle through the complete profile and automatically lift the

component off the board.

Application Note: When running a removal profile, it is recommended you insert the supplied K-Type

thermocouple between the target component and the PCB so that the thermocouple is in contact with,

and will accurately measure the temperature of the solder joint you are attempting to reflow. The ther-

mocouple can be secured to the PCB with the enclosed Kapton Tape. When developing a profile, this

will allow you to read an accurate solder joint temperature and make any “On-the-fly” changes.

19. Raise the nozzle assembly off of the PCB by rotating the “Z” axis lever on the reflow arm clockwise.

The BGA component that you have just removed will be suspended inside the nozzle by the vacuum

tube.

10. Using a heat resistant material, position it under the nozzle and turn the vacuum off. This will release

the component from the BGA head assembly.

Please do not use your hand to catch the component, even after the cooling cycle, the component can be

extremely hot.

SITE PREPARATION:

Solder Removal

Prepare the site to receive a new component by removing all of the residual solder. This can be done using

the supplied Metcal MX-500 Series Rework System with blade cartridge assembly. Employing Metcal Smart

Heat™ Technology into your rework process will eliminate the potential of accidentally removing any pads

when removing residual solder. This is because Metcal’s patented Smart Heat™ technology ensures that tip

temperature is constantly maintained, regardless of the thermal demand of the assembly that is being

reworked. For more information on Metcal Smart Heat™Technology, please contact your local Metcal repre-

sentative or Metcal directly.

The following blade style tips are available for the Metcal MX-500 Series Rework System:

SMTC-x60 (.410” length)

SMTC-x62 (.870” length)

SMTC-x61 (.620” length)

SMTC-x110 (1.55” length)

Please note that “x” denotes tip temperature. All cartridges are available in 500, 600 and 700 series

styles. (5 = 500°F, 0=600°F and 1=700°F)

As an option you can use a vacuum desoldering system such as the Metcal SP440 Self-Contained or MX-

500DS Shop-Air Desolder/Solder Rework System to vacuum residual solder from the PCB.

NOTE ON CLEANING

Although cotton swaps soaked with isopropyl alcohol work satisfactory for removing flux residue, it is strong-

BGA-3500 Series Manual 5/01

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