NCV51411(2019) 데이터 시트보기 (PDF) - ON Semiconductor
부품명
상세내역
일치하는 목록
NCV51411
(Rev.:2019)
(Rev.:2019)
ON Semiconductor
NCV51411 Datasheet PDF : 18 Pages
| |||
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC 16 LEAD WIDE BODY, EXPOSED PAD
CASE 751AG
ISSUE B
DATE 31 MAY 2016
SCALE 1:1
−U−
A
M
16
P
0.25 (0.010) M W M 1
9
B
8
−W−
PIN 1 I.D.
G 14 PL
TOP VIEW
R x 45_
DETAIL E
0.10 (0.004) T
D 16 PL
0.25 (0.010) M
C
−T−
K SEATING
PLANE
T U S WS
SIDE VIEW
H
F
J
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.13 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. 751R-01 OBSOLETE, NEW STANDARD 751R-02.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 10.15 10.45 0.400 0.411
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.50 0.90 0.020 0.035
G
1.27 BSC
0.050 BSC
H 3.45 3.66 0.136 0.144
J 0.25 0.32 0.010 0.012
K 0.00 0.10 0.000 0.004
L 4.72 4.93 0.186 0.194
M 0_ 7_ 0_ 7_
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
GENERIC
MARKING DIAGRAM*
1
EXPOSED PAD
16
8
L
9
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
AWLYYWWG
BOTTOM VIEW
SOLDERING FOOTPRINT*
0.175
0.050
0.350
Exposed
Pad
0.200
0.074
CL
0.188
CL
0.376
XXXXX = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
YY
= Year
WW = Work Week
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.024
0.150
DIMENSIONS: INCHES
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON21237D
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SOIC−16, WB EXPOSED PAD
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
Share Link: