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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

B32911A4562M289 데이터 시트보기 (PDF) - TDK Corporation

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B32911A4562M289
TDK
TDK Corporation TDK
B32911A4562M289 Datasheet PDF : 21 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
B32911*3 ... B32916*3
X1 / 330 V AC
Testing and Standards
Test
Reference
Conditions of test
Performance requirements
Electrical IEC
parameters 60384-14:2013
Voltage Proof:
Between terminals,
4.3 VR, 1 min.
Terminals and enclosure:
2 VR + 1500 V AC
Insulation resistance, Rins
Capacitance, C
Dissipation factor, tan δ
Within specified limits
Robustness IEC
Tensile strength (test Ua1)
of termina- 60068-2-21:2006 Wire diameter
Tensile
tions
force
Capacitance and tan δ
within specified limits
Resistance
to soldering
heat
IEC
60068-2-20:2008,
test Tb,
method 1A
0.5 < d1 0.8 mm 10 N
0.8 < d1 1.25 mm 20 N
Solder bath temperature at
260 ±5 °C, immersion for
10 seconds
ΔC/C0 5%
tan δ within specified limits
Rapid
IEC
change of 60384-14:2013
temperature
TA = lower category temperature No visible damage
TB = upper category temperature ΔC/C0 5%
Five cycles, duration t = 30 min. tan δ within specified limits
Vibration
IEC
60384-14:2013
Bump
IEC
60384-14:2013
Climatic IEC
sequence 60384-14:2013
Test FC: vibration sinusoidal
Displacement: 0.75 mm
No visible damage
Accleration: 98 m/s2
Frequency: 10 Hz ... 500 Hz
Test duration: 3 orthogonal axes,
2 hours each axe
Test Eb: Total 4000 bumps with No visible damage
400 m/s2 mounted on PCB
ΔC/C0 5%
6 ms duration
tan δ within specified limits
Dry heat Tb / 16 h
No visible damage
Damp heat cyclic, 1st cycle
ΔC/C0 5%
+55 °C / 24 h / 95% ... 100% RH Δ tan δ 0.008 for C 1 μF
Cold Ta / 2 h
Δ tan δ 0.005 for C > 1 μF
Damp heat cyclic, 5 cycles
Voltage proof
+55 °C / 24 h / 95% ... 100% RH Rins 50% of initial limit
Please read Cautions and warnings and
Important notes at the end of this document.
Page 8 of 21

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