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PBA31309

eUniStone BlueMoon™ Universal Platform Embedded

Intel 

eUniStone

PBA 31309

8.0 Bluetooth Qualification and Regulatory Certification ............................................... 31

8.1 Reference Design .............................................................................................. 31

8.2 FCC Class B Digital Devices Regulatory Notice....................................................... 32

8.3 FCC Wireless Notice........................................................................................... 32

8.4 FCC Interference Statement ............................................................................... 33

8.5 FCC Identifier ................................................................................................... 33

8.6 European R&TTE Declaration of Conformity........................................................... 34

8.7 Bluetooth Qualified Design ID ............................................................................. 34

8.8 Label Design of the Host Product......................................................................... 34

8.9 Regulatory Test House ....................................................................................... 34

8.10 Declaration of Conformity to European Standards .................................................. 35

9.0 Assembly Guidelines ............................................................................................... 36

9.1 General Description of the Module ....................................................................... 36

9.2 Printed Circuit Board Design ............................................................................... 37

9.3 Solder Paste Printing ......................................................................................... 38

9.4 Assembly ......................................................................................................... 38

9.4.1 Component Placement ............................................................................ 38

9.4.2 Pin Mark ............................................................................................... 38

9.4.3 Package................................................................................................ 39

9.5 Soldering Profile................................................................................................ 40

9.6 Rework ........................................................................................................... 41

9.6.1 Removal Procedure ............................................................................... 41

9.6.2 Replacement Procedure .......................................................................... 41

9.6.2.1 Alternative 1: Dispensing Solder ................................................. 41

9.6.2.2 Alternative 2: Printing Solder ..................................................... 42

9.7 Inspection........................................................................................................ 42

9.8 Component Salvage .......................................................................................... 43

9.9 Voids in the Solder Joints ................................................................................... 43

9.9.1 Expected Void Content and Reliability ....................................................... 43

9.9.2 Parameters with an Impact on Voiding ...................................................... 44

User’s Manual

Hardware Description

Intel Public

5

Revision 1.2, 23-Sep-2013

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