AXK764147G 데이터 시트보기 (PDF) - Panasonic Corporation
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AXK764147G
Panasonic Corporation
AXK764147G Datasheet PDF : 11 Pages
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AXK7, 8
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Item
Rated current
Rated voltage
Breakdown voltage
Insulation resistance
Contact resistance
Composite insertion force
Mechanical
characteristics
Composite removal force
Post holding force
Ambient temperature
Soldering heat resistance
Environmental
characteristics
Lifetime
characteristics
Unit weight
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H2S resistance
(header and socket mated)
Insertion and removal life
Specifications
0.3A/contact (Max. 5 A at total contacts)
60V AC/DC
150V AC for 1 min.
Min. 1,000MΩ (initial)
Max. 70mΩ
Max. 0.981N {100gf}/contacts × contacts (initial)
Min. 0.0588N {6gf}/contacts × contacts
(Mated height 1.5 mm, without removal and soldering
terminal)
Min. 0.118N {12gf}/contacts × contacts
(Mated height 1.5 mm, except without removal and
soldering terminal)
Min. 0.981N {100gf}/contacts
–55°C to +85°C
Max. peak temperature of 260°C (on the surface of the
PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 70mΩ
48 hours,
contact resistance max. 70mΩ
50 times
Mated height 1.5mm, 20 contacts;
Socket: 0.04g Header: 0.02g
Conditions
Detection current: 1mA
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No freezing at low temperatures
Infrared reflow soldering
Soldering iron
Sequence
1.
–55
0
–3
°C,
30
minutes
2. ~ , Max. 5 minutes
3.
85
+3
0
°C,
30
minutes
4. ~ , Max. 5 minutes
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Bath temperature 35±2°C,
saltwater concentration 5±1%
Bath temperature 40±2°C,
gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200
times/hours
2. Material and surface treatment
Part name
Material
Molded portion
LCP resin (UL94V-0)
Contact and Post
Copper alloy
Soldering terminal portion
Copper alloy
Surface treatment
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)
However, upper terminal of Ni barrier production: Exposed over Ni
The area adjacent to the terminal of the sockets on models with Ni barrier is exposed to Ni on base.
Ni plating on base, Sn plating on surface (Except for front terminal)
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