MPXAZ6115A6U 데이터 시트보기 (PDF) - Freescale Semiconductor

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MPXAZ6115A6U

High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.

VS

2

Sensing

Element

Thin Film

Temperature

Compensation

and

Gain Stage #1

Gain Stage #2

and Ground

Reference

Shift

Circuitry

4

VOUT

3

GND

Pins 1, 5, 6, 7, and 8 are NO CONNECTS

Figure 1. Fully Integrated Pressure Sensor Schematic

On-chip Temperature Compensation and Calibration

Figure 2 illustrates the absolute sensing chip in the basic

A fluorosilicone gel isolates the die surface and wire bonds

Super Small Outline chip carrier (Case 1317).

from the environment, while allowing the pressure signal to

Figure 3 shows a typical application circuit (output source

be transmitted to the silicon diaphragm. The MPXxx6115A

current operation).

series pressure sensor operating characteristics, internal

Figure 4 shows the sensor output signal relative to

reliability and qualification tests are based on use of dry air as

pressure input. Typical minimum and maximum output

the pressure media. Media other than dry air may have

curves are shown for operation over 0° to 85°C temperature

adverse effects on sensor performance and long-term

range. The output will saturate outside of the rated pressure

reliability. Contact the factory for information regarding media

range.

compatibility in your application.

Fluorosilicone

Gel Die Coat

Wire Bond

Lead

Frame

Die

P1

Stainless

Steel Cap

Thermoplastic

Case

Absolute Element

Die Bond

Sealed Vacuum Reference

Figure 2. Cross Sectional Diagram SSOP/SOP (not to scale)

+5.0 V

100 nF

VS Pin 2

MPXxx6115A

Vout Pin 4

GND Pin 3

to ADC

47 pF

51 K

MPXA6115A

4

Figure 3. Typical Application Circuit

(Output Source Current Operation)

Sensors

Freescale Semiconductor

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