MPXHZ6115AC6T1(2009) 데이터 시트보기 (PDF) - Freescale Semiconductor

부품명

상세내역

일치하는 목록

MPXHZ6115AC6T1
(Rev.:2009)

High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

Pressure

MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor package must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct pad

geometry, the packages will self-align when subjected to a

solder reflow process. It is always recommended to fabricate

boards with a solder mask layer to avoid bridging and/or

shorting between solder pads, especially on tight tolerances

and/or tight layouts.

0.660

16.76

0.100 TYP

2.54

0.060 TYP 8X

1.52

0.300

7.62

0.100 TYP 8X

inch

2.54

mm

Figure 5. SOP Footprint (Case 482)

0.150

3.81

0.050

1.27

TYP

0.387

9.83

0.027 TYP 8X

0.69

0.053 TYP 8X

inch

1.35

mm

Figure 6. SSOP Footprint (Case 1317 and 1317A)

Sensors

Freescale Semiconductor

MPXA6115A

7

Share Link: