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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

LT1083-12 데이터 시트보기 (PDF) - Linear Technology

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LT1083-12 Datasheet PDF : 12 Pages
First Prev 11 12
LT1083/LT1084/LT1085 Fixed
PACKAGE DESCRIPTIO
.256
(6.502)
.060
(1.524)
.060
(1.524)
.183
(4.648)
.075
(1.905)
.300
(7.620)
BOTTOM VIEW OF DD PAK
HATCHED AREA IS SOLDER PLATED
COPPER HEAT SINK
.420
.060
(1.524)
TYP
M Package
3-Lead Plastic DD Pak
(LTC DWG # 05-08-1460)
.390 – .415
(9.906 – 10.541)
15°
.165 – .180
(4.191 – 4.572)
.330 – .370
(8.382 – 9.398)
.059
(1.499)
.143
+.012
–.020
( ) 3.632
+0.305
–0.508
.050
(1.270)
.100
(2.54)
BSC
.080
.013 – .023
(0.330 – 0.584)
.420
.276
.045 – .055
(1.143 – 1.397)
.004
+.008
–.004
( ) 0.102
+
0.203
0.102
.095 – .115
(2.413 – 2.921)
.050 ± .012
(1.270 ± 0.305)
.350
.565
.325
.205
.565
.090
.100
.070
RECOMMENDED SOLDER PAD LAYOUT
.320
NOTE:
1. DIMENSIONS IN INCH/(MILLIMETER)
2. DRAWING NOT TO SCALE
.100
.090
.070
M (DD3) 0204
RECOMMENDED SOLDER PAD LAYOUT
FOR THICKER SOLDER PASTE APPLICATIONS
.560
(14.224)
.325
(8.255)
.275
(6.985)
P Package
3-Lead Plastic TO-3P (Similar to TO-247)
(LTC DWG # 05-08-1450)
.620 – .64O
(15.75 – 16.26)
MOUNTING HOLE
.115 – .145 18° – 22°
(2.92 – 3.68)
DIA
.187 – .207
(4.75 – 5.26)
.060 – .080
(1.52 – 2.03)
.580
(14.732)
.700
(17.780)
.830 – .870
(21.08 – 22.10)
.580 – .6OO
(14.73 – 15.24)
.170 – .2OO
(4.32 – 5.08)
EJECTOR PIN MARKS
.105 – .125
(2.67 – 3.18)
DIA
.098
(2.489)
.124
(3.149)
.170
(4.32)
MAX
.780 – .800
(19.81 – 20.32)
3° – 7°
BOTTOM VIEW OF TO-3P
HATCHED AREA IS SOLDER PLATED
COPPER HEAT SINK
.042 – .052
(1.07 – 1.32)
.074 – .084
(1.88 – 2.13)
.215
(5.46)
BSC
.113 – .123
(2.87 – 3.12)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
.087 – .102
(2.21 – 2.59)
.020 – .040
(0.51 – 1.02)
P3 0801
1083ffd
11

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