HA5002(1998) 데이터 시트보기 (PDF) - Intersil

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HA5002
(Rev.:1998)

110MHz, High Slew Rate, High Output Current Buffer

Intersil 

HA-5002

Plastic Leaded Chip Carrier Packages (PLCC)

0.042 (1.07)

0.048 (1.22)

PIN (1) IDENTIFIER

CL

0.042 (1.07)

0.056 (1.42)

0.050 (1.27) TP

0.004 (0.10) C

0.025 (0.64) R

0.045 (1.14)

CL

E1 E

D2/E2

D2/E2

VIEW “A”

0.020 (0.51) MAX

3 PLCS

D1

D

0.026 (0.66)

0.032 (0.81)

0.020 (0.51)

MIN

A1

A

-C-

SEATING

PLANE

0.013 (0.33)

0.021 (0.53)

N20.35 (JEDEC MS-018AA ISSUE A)

20 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE

INCHES

MILLIMETERS

SYMBOL MIN

MAX

MIN

MAX NOTES

A

0.165 0.180 4.20

4.57

-

A1

0.090 0.120 2.29

3.04

-

D

0.385 0.395 9.78 10.03

-

D1

0.350 0.356 8.89

9.04

3

D2

0.141 0.169 3.59

4.29

4, 5

E

0.385 0.395 9.78 10.03

-

E1

0.350 0.356 8.89

9.04

3

E2

0.141 0.169 3.59

4.29

4, 5

N

20

20

6

Rev. 2 11/97

0.045 (1.14)

MIN

0.025 (0.64)

MIN

VIEW “A” TYP.

NOTES:

17. Controlling dimension: INCH. Converted millimeter dimensions

are not necessarily exact.

18. Dimensions and tolerancing per ANSI Y14.5M-1982.

19. Dimensions D1 and E1 do not include mold protrusions. Allowable

mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1

and E1 include mold mismatch and are measured at the extreme

material condition at the body parting line.

20. To be measured at seating plane -C- contact point.

21. Centerline to be determined where center leads exit plastic body.

22. “N” is the number of terminal positions.

11

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