SBSGC1000104MX 데이터 시트보기 (PDF) - Unspecified

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SBSGC1000104MX

Surface Mount EMI Filters

Unspecified 

Ordering Information

SBS

G

Type

Surface

mount board

filter

Size

G = 1812

P

Configuration

C = C section

P = Pi Section

500

Rated Voltage

050 = 50Vdc

100 = 100Vdc

200 = 200Vdc

500 = 500Vdc

0473

Capacitance in Pico farads (pF)

First digit is 0.

Second and third digits are significant

figures of capacitance code. The fourth

digit is number of zeros following.

Example:

0473 = 47nF

M

Tolerance

M = ±20%

Reeled Quantities

178mm (7”) reel

1812

500

330mm (13”) reel

1812

2000

X

Dielectric

X = X7R

T

Packaging

T=178mm

(7”) reel

R=330mm

(13”) reel

B = Bulk

Surface mount and panel mount solder-in filters

Solder pad layouts are included with the detailed information

for each part.

Recommended soldering profile

Soldering of filters

The soldering process should be controlled such that the filter

does not experience any thermal shocks which may induce

thermal cracks in the ceramic dielectric.

The pre-heat temperature rise of the filter should be kept to

around 2°C per second. In practice successful temperature

rises tend to be in the region of 1.5°C to 4°C per second

dependent upon substrate and components.

The introduction of a soak after pre-heat can be useful as it

allows temperature uniformity to be established across the

substrate thus preventing substrate warping. The magnitude

or direction of any warping may change on cooling imposing

damaging stresses upon the filter.

E01, E03, E07 SBSP ranges are compatible with all standard

solder types including lead-free, maximum temperature

260°C. For SBSG, SBSM and SFSS ranges, solder time should

be minimised, and the temperature controlled to a maximum

of 220°C. For SFSR, SFST and SFSU ranges the maximum

temperature is 250°C.

Cooling to ambient temperature should be allowed to occur

naturally. Natural cooling allows a gradual relaxation of

thermal mismatch stresses in the solder joints. Draughts

should be avoided. Forced air cooling can induce thermal

breakage, and cleaning with cold fluids immediately after a

soldering process may result in cracked filters.

Note: The use of FlexiCap™ terminations is strongly

recommended to reduce the risk of mechanical cracking.

Soldering to axial wire leads

Soldering temperature

The tip temperature of the iron should not exceed 300°C.

Dwell time

Dwell time should be 3-5 seconds maximum to minimise the

risk of cracking the capacitor due to thermal shock.

Heat sink

Where possible, a heat sink should be used between the solder

joint and the body, especially if longer dwell times are

required.

Bending or cropping of wire leads

Bending or cropping of the filter terminations should not be

carried out within 4mm (0.157”) of the epoxy encapsulation,

the wire should be supported when cropping.

A more comprehensive application note covering

installation of all Syfer products is available on the

Syfer website.

SBSGDatasheet Issue 1 (P107545) Release Date 26/04/13

Page 3 of 3

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