![](/html/Sony/8583/page11.png)
Package Outline
Unit: mm
22 pin DIP (400mil)
10.2 ± 0.3
55.7 ± 0.3
37.38 (3.5µm × 10680Pixels)
22
12
V
H
No.1 Pixel (Green)
1
11
4.95 ± 0.6
2.54
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
DRAWING NUMBER
Plastic, Ceramic
GOLD PLATING
42 ALLOY
5.43g
LS-B30(E)
0.51
0.3 M
1. The height from the bottom to the sensor surface is 2.38 ± 0.3mm.
2. The thickness of the cover glass is 0.7mm, and the refractive in 1.5.