AC05000001007JAC00 데이터 시트보기 (PDF) - Vishay Semiconductors
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AC05000001007JAC00 Datasheet PDF : 10 Pages
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www.vishay.com
AC.. Series
Vishay Draloric
BENDING FORMS
WSZ
TYPE
AC03 WSZ
E
Ød
Ød
0.8
A
L
a
ØD
I
H
F
b
Solder pad dimensions
Ø Dmax.
A
L
F
H
E
a
b
(1)
17 ± 0.5 11 - 12 4.8 ± 0.5 3.6 ± 0.5 5.0 ± 0.5
2.5
5.5
P2
P
Δh1
l
14.5
L
ØD
H1
RADIAL TAPED = RT
d
W2
1 max.
H H0
t
L1
P1 F
W0 W1
W
P0
D0
TYPE AC01
Lead Ø
Diameter
Length
Pitch of components
Pitch of spocket holes (2)
Distance between hole center and resistor center
Distance between hole center and lead center
Lead spacing
Angle of insertion
Width of carrier tape
Width of adhesive tape
Position of holes
Position of adhesive tape
Body to hole center
Lead crimp to hole center (3)
Hole Ø
Thickness of tape (4)
Height for cutting
Height for insertion
Notes
(1) See table DIMENSIONS
(2) Test over 10 holes - 9 intervals P0 12.7 x 9 = 114.3 ± 0.5
(3) Parallelism, < 0.5 mm
(4) Thickness of carrier tape: 0.55 mm ± 0.1
Direction of Unreeling
Ød
ØD
L
P
P0
P1
P2
F
h1
W
W0
W1
W2
H
H0
D0
t
L1
H1
0.8
(1)
(1)
12.7 ± 1.0
12.7 ± 0.3
3.85 ± 0.7
6.35 ± 1.0
5.0 + 0.6, - 0.1
2 max.
18.0 ± 0.5
12.0 ± 0.5
9.0 ± 0.5
0.5 max.
19.5 ± 1.0
16.0 ± 0.5
4.0 ± 0.2
0.9 max.
11 max.
32 max.
Revision: 13-Jan-14
4
Document Number: 28730
For technical questions, contact: ww1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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