MPXT5006D 데이터 시트보기 (PDF) - Motorola => Freescale
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MPXT5006D
Motorola => Freescale
MPXT5006D Datasheet PDF : 4 Pages
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MPXT5006D SERIES
ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by inte-
grating the shear–stress strain gauge, temperature com-
pensation, calibration and signal conditioning circuitry onto a
single monolithic chip.
Figure 3 illustrates the differential or gauge configuration in
the basic chip carrier (Case 473). A fluorosilicone gel isolates
the die surface and wire bonds from harsh environments,
while allowing the pressure signal to be transmitted to the sili-
con diaphragm.
The MPXT5006D series sensor operating characteristics
are based on use of dry air as pressure media. Media, other
than dry air, may have adverse effects on sensor performance
and long–term reliability. Internal reliability and qualification
test for dry air, and other media, are available from the factory.
Contact the factory for information regarding media tolerance
in your application.
Figure 4 shows a typical decoupling circuit for interfacing
the output of the MPXT5006D to the A/D microprocessor.
Proper decoupling of the power supply is recommended.
Figure 5 shows the sensor output signal relative to pres-
sure input. Typical, minimum and maximum output curves
are shown for operation over 10°C to 60°C. (Device output
may be nonlinear outside of the rated pressure range.)
PRESSURE (P1) / VACUUM (P2) SIDE IDENTIFICATION
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
which protects the die from the environment. The Motorola
pressure sensor is designed to operate with positive differen-
tial pressure applied, P1 > P2.
STAINLESS STEEL
METAL COVER
WIRE BONDS
EPOXY CASE
P1
P2
RTV DIE BOND
FLUOROSILICONE
DIE COAT
CONSTRAINED
VENTED DIE
MPXT5006D
OUTPUT
(PIN 1)
50 pF
A/D
51 k
µ PROCESSOR
EXTERNAL LEAD
CONNECTIONS
Figure 3. Cross–Sectional Diagram (Not to Scale)
Figure 4. Typical Decoupling Filter for Sensor to
Microprocessor Interface
5.0
TRANSFER FUNCTION:
4.5 Vout = VS*[(0.1533*P) + 0.045] ± 3% VFSS
4.0 VS = 5.0 Vdc
TEMP = 10 to 60°C
3.5
3.0
TYPICAL
2.5
2.0
1.5 MAX
MIN
1.0
0.5
0
0
3
6
DIFFERENTIAL PRESSURE (kPa)
Figure 5. Output versus Pressure Differential
(See Note 5 in Operating Characteristics)
Motorola Sensor Device Data
3
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