NOTES (Unit: mm)
As shown below, excess force during insertion may result
in damage to the connector or removal of the solder. Also,
to prevent connector damage please confirm the correct
position before mating connectors.
Narrow pitch connectors P35S (0.35mm pitch)
Keep the PC board warp no more than 0.03 mm in relation
to the overall length of the connector
Max. 0.03 mm
Max. 0.03 mm
If extra resistance to shock caused by dropping is required,
we recommend using P4 series (0.4 mm pitch).
Design of PC board patterns
Conduct the recommended foot pattern design, in order to
preserve the mechanical strength of terminal solder areas.
Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of 0.35
mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise,
solder bridges and other issues make sure the proper levels of
solder is used.
Socket (Mated height: 1.5 mm)
Recommended PC board pattern
(TOP VIEW)
0.35±0.03
0.20±0.03
The figures are recommended patterns. Please use them as a
reference.
Header (Mated height: 1.5 mm)
Recommended PC board pattern
(TOP VIEW)
0.35±0.03
0.20±0.03
0.70±0.03
0.85±0.03
Recommended metal mask pattern
Metal mask thickness: When 120μm
(Terminal opening ratio: 60%)
(Metal-part opening ratio: 100%)
0.35±0.01
0.18±0.01
0.70±0.01
0.85±0.01
0.45±0.03
0.70±0.03
:Insulation area
Recommended metal mask pattern
Metal mask thickness: When 120μm
(Terminal opening ratio: 60%)
(Metal-part opening ratio: 100%)
0.35±0.01
0.18±0.01
0.45±0.01
0.70±0.01
Please refer to “the latest product specifications” when designing your product.
• Requests to customers:
https://industrial.panasonic.com/ac/e/salespolicies/
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ACCTB113E 201809-T