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CRGH2010F200K 데이터 시트보기 (PDF) - TE Connectivity

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CRGH2010F200K
Te
TE Connectivity Te
CRGH2010F200K Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
THICK FILM CHIP RESISTORS
Performance Specification:
Characteristic
*Insulation
Resistance
*Dielectric
Withstanding
Voltage
Temperature
Coefficient of
Resistance
(TCR)
Short Term
Overload
*Solderability
Soldering
Temp.
Reference
Specification
, MΩ Mi .
No evidence of flashover
mechanical damage, arcing
or insulation break down
Ω- Ω : ± PPM/
. Ω- Ω : ± PPM/
Ω~ MΩ : ± PPM/
For : > Ω : ±
PPM/
Resistance change rate is:
± % . % + . Ω Ma .
± % . % + . Ω Ma .
95 % coverage Min.
Electrical characteristics
shall be satisfied without
distinct deformation in
appearance.
(95 % coverage Min.)
Test Methods
(JIS C 5201-1)
Apply 500V DC between protective coating
and termination for 1 min, then measure
(Sub-clause 4.6)
Apply 100V(0402) 300V(0603) & 500V
(0805,1206,1210,2010,2512) AC between
protective coating and termination for 1
minute (Sub-clause 4.7)
Natural resistance change per temp.
degree centigrade.
R1: Resistance value at room temperature
(t1)
R2: Resistance value at room temp. plus
100 (t2)
(Sub-clause 4.8)
Permanent resistance change after the
application of a potential of 2.5 times
RCWV for 5 seconds
(Sub-clause 4.13)
Test temperature of solder : 245 ±3°C
Dipping time solder : 2-3 seconds
(Sub-clause 4.17)
Wave soldering condition: (2 cycles Max.)
Pre-heat : 100 ~ 120 , 30 ± 5 sec.
Suggestion solder temp.: 235 ~ 255 , 10
sec. (Max.)
Peak temp.: 260
Reflow soldering condition: (2 cycles
Max.)
Pre-heat : 150 ~ 180 , 90 ~ 120 sec.
Suggestion solder temp.: 235 ~ 255 , 20 ~
40 sec.
Peak temp.: 260
Soldering
Heat
Resistance change rate is:
± %+ . Ω Ma .
Hand soldering condition:
The soldering iron tip temperature should
be less than 300and maximum contract
time should be 5 sec.
Dip the resistor into a solder bath having a
temperature of 260°C±3°C and hold it for
10±1 seconds.
(Sub-clause 4.18)
1773204 Rev J 12/2018
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
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