RCL06121R62FKEK 데이터 시트보기 (PDF) - Vishay Semiconductors
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RCL06121R62FKEK Datasheet PDF : 9 Pages
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DIMENSIONS
H
T2
L
RCL e3
Vishay Draloric
DIMENSIONS AND MASS
TYPE / SIZE
L
(mm)
RCL0406 e3
1.0 ± 0.10
RCL0612 e3
1.6 ± 0.20
RCL1020 e3
2.5 ± 0.20
RCL1218 e3
3.2 +0.10 / -0.20
RCL1225 e3
3.2 ± 0.20
T1
W
(mm)
1.6 ± 0.10
3.2 ± 0.20
5.0 ± 0.20
4.6 ± 0.15
6.3 ± 0.20
SOLDER PAD DIMENSIONS
W
H
(mm)
0.35 ± 0.10
0.55 ± 0.10
0.55 ± 0.10
0.55 ± 0.05
0.70 ± 0.10
T1
(mm)
0.2 +0.10 / -0.15
0.35 ± 0.15
0.38 ± 0.15
0.45 ± 0.20
0.8 ± 0.20
T2
(mm)
0.2 ± 0.10
0.25 ± 0.15
0.25 ± 0.15
0.4 ± 0.20
0.4 ± 0.20
MASS
(mg)
2
11
25.5
29.5
55
G
X
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE / SIZE
RCL0406 e3
G
(mm)
0.30
WAVE SOLDERING
Y
(mm)
X
(mm)
0.80
1.95
Z
(mm)
1.90
G
(mm)
0.35
REFLOW SOLDERING
Y
(mm)
X
(mm)
0.60
1.75
Z
(mm)
1.55
RCL0612 e3
0.50
1.20
3.70
2.90
0.60
1.00
3.50
2.60
RCL1020 e3
1.30
1.25
5.50
3.80
1.30
1.10
5.25
3.50
RCL1218 e3
RCL1225 e3
1.80
1.30
5.10
4.40
1.90
1.10
4.90
4.10
1.10
1.80
6.80
4.70
1.20
1.60
6.60
4.40
Notes
• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g in standards IEC 61188-5-x (1) or
in publication IPC-7351.
Still, the given solder pad dimensions will be found adequate for most general applications
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
Revision: 12-Jul-17
8
Document Number: 20046
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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