TDA7479D 데이터 시트보기 (PDF) - STMicroelectronics

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TDA7479D

Single chip RDS demodulator + filter

STMicroelectronics 

TDA7479

5

Package information

Package information

In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®

packages. ECOPACK® packages are lead-free. The category of second Level Interconnect

is marked on the package and on the inner box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to soldering conditions are also marked on the inner

box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 4. SO16 mechanical data and package dimensions

DIM.

MIN.

mm

TYP. MAX. MIN.

inch

TYP. MAX.

A 2.35

2.65 0.093

0.104

A1 0.10

0.30 0.004

0.012

B 0.33

0.51 0.013

0.200

C 0.23

0.32 0.009

0.013

D (1) 10.10

10.50 0.398

0.413

E 7.40

7.60 0.291

0.299

e

1.27

0.050

H 10.0

10.65 0.394

0.419

h 0.25

0.75 0.010

0.030

L 0.40

1.27 0.016

0.050

k

0˚ (min.), 8˚ (max.)

ddd

0.10

0.004

(1) “D” dimension does not include mold flash, protusions or gate

burrs. Mold flash, protusions or gate burrs shall not exceed

0.15mm per side.

OUTLINE AND

MECHANICAL DATA

SO16 (Wide)

0016021 C

9/12

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