5.0 MECHANICAL
SPECIFICATIONS FOR DIE
AND WAFER
FIGURE 5-1:
DIE PLOT
Device Test Only
VSS VCC RESET I/O
VB
VA
MCRF200
TABLE 5-1: PAD COORDINATES (µm)
Passivation
Openings
Pad
Name
VA
Pad
Width
90.0
Pad
Height
90.0
Pad
Pad
Center X Center Y
427.50 -734.17
VB
90.0
90.0 -408.60 -734.17
Note 1: All coordinates are referenced from the
center of the die.
2: Die size: 1.1215 mm x 1.7384 mm
44.15 mils x 68.44 mils
TABLE 5-2:
Name
VA
VB
VSS
VCC
RESET
I/O
PAD FUNCTION TABLE
Function
Antenna Coil connection
For device test only
Do Not Connect to Antenna
2003 Microchip Technology Inc.
DS21219H-page 11