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MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>
PS21562-SP
TRANSFER-MOLD TYPE
INSULATED TYPE
Fig. 2 THE DIP-IPM INTERNAL CIRCUIT
VUFB
VUFS
VP1
UP
VVFB
VVFS
VP1
VP
VWFB
VWFS
VP1
VP
VN1
Fo
UN
VN
WN
VNC
HVIC1
VCC VB
IN HO
COM VS
IGBT1
DIP-IPM
P
Di1
U
HVIC2
VCC VB
IGBT2
Di2
IN HO
COM VS
V
HVIC3
VCC VB
IN HO
COM VS
IGBT3
Di3
LVIC
IGBT4
Di4
UOUT
VCC
IGBT5
Di5
Fo
VOUT
UN
IGBT6
Di6
VN
WOUT
WN
VNO
GND
CIN
CFO
W
NU
NV
NW
VNO
CIN
CFO
Jul. 2005