MK10FN32ACMP12 데이터 시트보기 (PDF) - Freescale Semiconductor
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MK10FN32ACMP12 Datasheet PDF : 79 Pages
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Table of Contents
1 Ordering parts...........................................................................4
5.4.2 Thermal attributes.................................................22
1.1 Determining valid orderable parts......................................4
6 Peripheral operating requirements and behaviors....................23
2 Part identification......................................................................4
6.1 Core modules....................................................................23
2.1 Description.........................................................................4
6.1.1 Debug trace timing specifications.........................23
2.2 Format...............................................................................4
6.1.2 JTAG electricals....................................................24
2.3 Fields.................................................................................4
6.2 System modules................................................................27
2.4 Example............................................................................5
6.3 Clock modules...................................................................27
3 Terminology and guidelines......................................................5
6.3.1 MCG specifications...............................................27
3.1 Definition: Operating requirement......................................5
6.3.2 Oscillator electrical specifications.........................29
3.2 Definition: Operating behavior...........................................6
6.3.3 32 kHz oscillator electrical characteristics.............31
3.3 Definition: Attribute............................................................6
6.4 Memories and memory interfaces.....................................32
3.4 Definition: Rating...............................................................7
6.4.1 Flash electrical specifications................................32
3.5 Result of exceeding a rating..............................................7
6.4.2 EzPort switching specifications.............................37
3.6 Relationship between ratings and operating
6.4.3 Flexbus switching specifications...........................38
requirements......................................................................7
6.5 Security and integrity modules..........................................41
3.7 Guidelines for ratings and operating requirements............8
6.6 Analog...............................................................................41
3.8 Definition: Typical value.....................................................8
6.6.1 ADC electrical specifications.................................41
3.9 Typical value conditions....................................................9
6.6.2 CMP and 6-bit DAC electrical specifications.........49
4 Ratings......................................................................................10
6.6.3 12-bit DAC electrical characteristics.....................52
4.1 Thermal handling ratings...................................................10
6.6.4 Voltage reference electrical specifications............55
4.2 Moisture handling ratings..................................................10
6.7 Timers................................................................................56
4.3 ESD handling ratings.........................................................10
6.8 Communication interfaces.................................................56
4.4 Voltage and current operating ratings...............................10
6.8.1 CAN switching specifications................................56
5 General.....................................................................................11
6.8.2 DSPI switching specifications (limited voltage
5.1 AC electrical characteristics..............................................11
range)....................................................................57
5.2 Nonswitching electrical specifications...............................11
6.8.3 DSPI switching specifications (full voltage range).58
5.2.1 Voltage and current operating requirements.........11
6.8.4 Inter-Integrated Circuit Interface (I2C) timing........60
5.2.2 LVD and POR operating requirements.................12
6.8.5 UART switching specifications..............................61
5.2.3 Voltage and current operating behaviors..............13
6.8.6 SDHC specifications.............................................61
5.2.4 Power mode transition operating behaviors..........15
6.8.7 I2S/SAI switching specifications............................62
5.2.5 Power consumption operating behaviors..............16
6.9 Human-machine interfaces (HMI)......................................68
5.2.6 EMC radiated emissions operating behaviors.......19
6.9.1 TSI electrical specifications...................................68
5.2.7 Designing with radiated emissions in mind...........20
7 Dimensions...............................................................................69
5.2.8 Capacitance attributes..........................................20
7.1 Obtaining package dimensions.........................................69
5.3 Switching specifications.....................................................20
8 Pinout........................................................................................69
5.3.1 Device clock specifications...................................20
8.1 K10 signal multiplexing and pin assignments....................69
5.3.2 General switching specifications...........................21
8.2 K10 pinouts.......................................................................75
5.4 Thermal specifications.......................................................22
9 Revision history.........................................................................77
5.4.1 Thermal operating requirements...........................22
K10 Sub-Family Data Sheet, Rev. 3, 6/2013.
Freescale Semiconductor, Inc.
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