LMK042B7101KC-FW 데이터 시트보기 (PDF) - TAIYO YUDEN
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LMK042B7101KC-FW Datasheet PDF : 27 Pages
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Chip filled
Chip
※ LW Reverse type.
③Representative taping dimensions
●Paper Tape（8mm wide）
●Pressed carrier tape（ 2mm pitch）
φ1.5＋0.1/－0
Sprocket hole
(φ0.059＋0.004/-0)
1.75±0.1
(0.069±0.004）
Unit：mm（inch）
T
A
B
T1
F 2.0±0.05
4.0±0.1
(0.079±0.002) (0.157±0.004)
Type(EIA)
Chip Cavity
Ａ
Ｂ
□MK063(0201)
0.37
0.67
□WK105(0204) ※
□MK105(0402) （*1 C）
0.65
1.15
□MK105(0402) （*1 P）
Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type.
Insertion Pitch
Ｆ
2.0±0.05
●Punched carrier tape （2mm pitch）
φ1.5＋0.1/－0
Sprocket hole
(φ0.059＋0.004/-0)
1.75±0.1
(0.069±0.004）
Unit：mm（inch）
T
A
B
Tape Thickness
Ｔ
T1
0.45max.
0.42max.
0.4max.
0.45max.
0.3max.
0.42max.
Unit：mm
F 2.0±0.05
4.0±0.1
(0.079±0.002) (0.157±0.004)
Type(EIA)
□MK105 (0402)
□MF105 (0402)
□VK105 (0402)
Chip Cavity
Ａ
Ｂ
0.65
1.15
Insertion Pitch
Ｆ
2.0±0.05
●Punched carrier tape （4mm pitch）
φ1.5＋0.1/－0
Sprocket hole
(φ0.059＋0.004/-0)
1.75±0.1
(0.069±0.004）
Unit：mm（inch）
T
A
B
Tape Thickness
Ｔ
0.8max.
Unit：mm
F
4.0±0.1
(0.157±0.004)
2.0±0.1
(0.079±0.004)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E06R01
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