HA7-5020 데이터 시트보기 (PDF) - Intersil
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HA7-5020 Datasheet PDF : 19 Pages
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Die Characteristics
DIE DIMENSIONS:
65 x 60 x 19 mils ± 1 mils
1640µm x 1520µm x 483µm ± 25.4µm
METALLIZATION:
Type: Al, 1% Cu
Thickness: 16kÅ ± 2kÅ
WORST CASE CURRENT DENSITY:
5.77 x 104 A/cm2 at 30mA
SUBSTRATE POTENTIAL (Powered Up): V-
GLASSIVATION:
Type: Nitride over Silox
Silox Thickness: 12kÅ ± 2kÅ
Nitride Thickness: 3.5kÅ ± 1kÅ
TRANSISTOR COUNT: 62
PROCESS: Bipolar Dielectric Isolation
Metallization Mask Layout
HA-5020/883
HA-5020/883
BAL
DISABLE
V+
-IN
2
1
8
7
+IN
3
4
V-
5
BAL
3-99
6
OUT
Spec Number 511080-883
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