UPC1458C 데이터 시트보기 (PDF) - NEC => Renesas Technology

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UPC1458C

GENERAL PURPOSE DUAL OPERATIONAL AMPLIFIER

NEC => Renesas Technology 

µPC1458

RECOMMENDED SOLDERING CONDITIONS

The µPC1458 should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

TYPES OF SURFACE MOUNT DEVICE

µPC1458G2: 8-pin plastic SOP (5.72 mm (225))

Process

Infrared Ray Reflow

Vapor Phase Soldering

Wave Soldering

Partial Heating Method

Conditions

Peak temperature: 230°C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210°C or higher),

Maximum number of reflow processes: 1 time.

Peak temperature: 215°C or below (Package surface temperature),

Reflow time: 40 seconds or less (at 200°C or higher),

Maximum number of reflow processes: 1 time.

Solder temperature: 260°C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120°C or below (Package surface temperature).

Pin temperature: 300°C or below,

Heat time: 3 seconds or less (Per each side of the device).

Symbol

IR30-00-1

VP15-00-1

WS60-00-1

–

Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the

device will be damaged by heat stress.

TYPES OF THROUGH HOLE DEVICE

µPC1458C: 8-pin plastic DIP (7.62 mm (300))

Soldering method

Soldering conditions

Wave soldering

Solder temperature: 260°C or below,

Flow time: 10 seconds or below

Recommended condition

symbol

8

Data Sheet G12195EJ6V0DS

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