5 MIL THICK
ALUMINA
50Ω
DIE-ATTACH
80Au/20Sn
5 MIL THICK
ALUMINA
50Ω
RF INPUT
RF OUTPUT
2 MIL GAP
L < 0.015"
(2 Places)
Note:
Use 0.003" by 0.0005" Gold Ribbon for bonding. RF input and output bonds should be less than 0.015" long with stress relief.
Figure 3. Recommended Assembly Diagram
Recommended Procedure for Operation
The following sequence must be followed to properly test
the amplifier.
Step 1: The RMWT1101 does not require DC bias. Apply
RF input signal at the appropriate frequency band and input
drive level.
Step 2: Follow turn-off sequence of:
Turn off RF input power.
©2004 Fairchild Semiconductor Corporation
RMWT11001 Rev. C