MRS1504T3G(2012) 데이터 시트보기 (PDF) - ON Semiconductor
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MRS1504T3G Datasheet PDF : 6 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 1:1
Polarity Band
SCALE 1:1
Non−Polarity Band
SMB
CASE 403A−03
ISSUE J
DATE 19 JUL 2012
HE
E
bD
POLARITY INDICATOR
OPTIONAL AS NEEDED
L
L1 c
A1
SOLDERING FOOTPRINT*
2.261
0.089
2.743
0.108
2.159
0.085
ǒ Ǔ SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
MILLIMETERS
DIM MIN NOM MAX
A 1.95
2.30
2.47
A1 0.05
0.10
0.20
b
1.96
2.03
2.20
c
0.15
0.23
0.31
D 3.30
3.56
3.95
E 4.06
4.32
4.60
H E 5.21
5.44
5.60
L
0.76
1.02
1.60
L1
0.51 REF
MIN
0.077
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.091
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.097
0.008
0.087
0.012
0.156
0.181
0.220
0.063
A
GENERIC
MARKING DIAGRAM*
AYWW
XXXXXG
G
AYWW
XXXXXG
G
Polarity Band
Non−Polarity Band
XXXXX = Specific Device Code
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER: 98ASB42669B
DESCRIPTION: SMB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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